| Manufacturing capabilities | Conventional | Unconventional | |||||
|---|---|---|---|---|---|---|---|
| Item | Classify | Project Item | Unit | Prototype | Small Production Volumes | Production Volumes | R&D Capabilities |
| 141 | Manufacturing | Minimum width of external layer through hole PAD single side | mil | 3(12, 18um), 4(35um), 6(70um), 6(105um), 8(140um) | 4(12, 18um), part 3.5, 4.5(35um), 6(70um), 8(105um),10(140um) | 4(12, 18um), part 3.5, 4.5(35um), 6(70um), 8(105um),10(140um) | |
| 142 | Manufacturing | Minimum distance between hole to conductor (excluding blind and burried board) | mil | 5.5(≤8L),6(≤12L)7(≤28L) | 6(≤8L),7(≤12L),8(≤28L) | 7(≤8L),8(≤12L),10(≤28L) | |
| 143 | Manufacturing | Minimum Inner Isolation Ring width (single side) | mil | 8(≤6L),10(≥8L), Part shave PAD can be 8 | 10(≤6L),12(≥8L), Part shave PAD can be 8 | 10(≤6L),12(≥8L), Part shave PAD can be 8 | |
| 144 | Manufacturing | Maximum height of Gold finger | inch | 2 | 2 | 2 | |
| 145 | Manufacturing | Minimum single side solder mask opening | mil | 1 | 1.5-2 | 2 | <1mil, to be evaluated |
| 146 | Manufacturing | Minimum single side width of line covered by solder mask | mil | 2 | 2.5 | 2.5 | <2mil, to be evaluated |
| 147 | Manufacturing | Minimum isolation of carbon ink and pad | mil | 8 | 10 | 12 | |
| 148 | Manufacturing | Minmum single side line or pad covered by peelable mask | mil | 2 | 3 | 3 | <2mil, to be evaluated |
| 149 | Manufacturing | Minimum isolation of peelable mask and pad | mil | 12 | 14 | 14 | <12mi, to be evaluated |
| 150 | Manufacturing | Maximum diameter of peelable mask white mesh plug hole | mm | 2 | 2 | 2 | |
| 151 | Manufacturing | Minmum width and height of silk screen (12, 18um base copper) | width 4mil, height 28mil | width 4mil, height 30mil | width 4mil, height 35mil | ||
| 152 | Manufacturing | Minmum width and height of silk screen (35um base copper) | width 5mil, height 30mil | width 5mil, height 32mil | width 5mil, height 32mil | ||
| 153 | Manufacturing | Minmum width and height of silk screen (70um base copper) | width 6mil, height 36mil | width 6mil, height 38mil | width 6mil, height 40mil | ||
| 154 | Manufacturing | Minimum isolation between character and pad | mil | 4 | 5 | 6 | |
| 155 | Manufacturing | Board thickness tolerance (≤1.0mm) | mm | ±0.1 | ±0.15 | ±0.15 | <0.1mm, to be evaluated |
| 156 | Manufacturing | Board thickness tolerance (>1.0mm) | mm | 2.0≤+/-0.1 | ±8% | ±10% | ±5%, to be evaluated |
| 157 | Manufacturing | Special tolerance requirement of board thickness | mm | ≤2.0±0.1, 2.0-3.0 ±0.15, ≥3.0±0.2 | / | / | |
| 158 | Manufacturing | Outline shape type | Routing, V-cut, break-out tabs, stamp holes | Routing, V-cut, break-out tabs, stamp holes | Routing, V-cut, break-out tabs, stamp holes | ||
| 159 | Manufacturing | Minimum outline routing bit diameter | mm | 0.6( Max board thickness 2.0mm) | 0.8 | 1.0 | |
| 160 | Manufacturing | V-CUT angle tolerance | o | ±5° | ±5° | ±5° | |
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