| Manufacturing capabilities | Conventional | Unconventional | |||||
|---|---|---|---|---|---|---|---|
| Item | Classify | Project Item | Unit | Prototype | Small Production Volumes | Production Volumes | R&D Capabilities |
| 81 | Equipment | Second Cu plating line | 0.10-6.0mm,max 23*100inch | 0.10-6.0mm,max 23*100inch | 0.10-6.0mm,max 23*100inch | / | |
| 82 | Equipment | Desmear+PTH line | 2 process | 0.10-6.0mm,max 18*24inch | 0.10-6.0mm,max 18*24inch | 0.10-6.0mm,max 18*24inch | |
| 83 | Equipment | CCD Target drilling machine | 0.1-6.0mm | 0.1-6.0mm | 0.1-6.0mm | / | |
| 84 | Equipment | Alkaline etching line | 0.10-6.0mm,max 7*7inch | 0.10-6.0mm,max 7*7inch | 0.10-6.0mm,max 7*7inch | / | |
| 85 | Equipment | Zhao Fang LED exposed machine | 0.05-7.0mm,max600mm*1200mm | 0.05-7.0mm,max600mm*1200mm | 0.05-7.0mm,max600mm*1200mm | / | |
| 86 | Equipment | Ao Bao 8200 AOI machine | 2 process | 0.05-6.0mm,610*660mm | 0.05-6.0mm,610*660mm | 0.05-6.0mm,610*660mm | / |
| 87 | Equipment | Solder mask developing machine | 0.4-7.0mm,min 4*5inch | 0.4-7.0mm,min 4*5inch | 0.4-7.0mm,min 4*5inch | / | |
| 88 | Equipment | Zheng Ye silkscreen machine | 0.1-6.0mm660mm x 600mm | 0.1-6.0mm660mm x 600mm | 0.1-6.0mm660mm x 600mm | / | |
| 89 | Equipment | Pressing machine | 0.075-7.0mm,500*600mm | 0.075-7.0mm,500*600mm | 0.075-7.0mm,500*600mm | / | |
| 90 | Equipment | HAL line | 2 process | 0.6-4.0mm,min 5*5；max 20*25inch | 0.6-4.0mm,min 5*5；max 20*25inch | 0.6-4.0mm,min 5*5；max 20*25inch | / |
| 91 | Equipment | EMMA Test machine | 0.4-7.0mm,600*500mm | 0.4-7.0mm,600*500mm | 0.4-7.0mm,600*500mm | / | |
| 92 | Equipment | MIC Test machine | 0.4-6.0mm,m550*450mm | 0.4-6.0mm,m550*450mm | 0.4-6.0mm,m550*450mm | / | |
| 93 | Equipment | MV-300 Test machine | 0.4-3.0mm,600*500mm | 0.4-3.0mm,600*500mm | 0.4-3.0mm,600*500mm | / | |
| 94 | Equipment | V-CUT machine | <0.6mm Cut1-side | 0.6-3.0mm,80*380mm | 0.6-3.0mm,80*380mm | 0.6-3.0mm,80*380mm | / |
| 95 | Equipment | Finished cleaning machine | 0.2-6.0mm，max 24*24in，min 4*4in | 0.2-6.0mm，max 24*24in，min 4*4in | 0.2-6.0mm，max 24*24in，min 4*4in | / | |
| 96 | Manufacturing | Suface finish | Lead / lead free HAL, Immersion Gold (EING), Immersion Tin, Immersion Silver, OSP, Hard gold plating, ENIG+OSP, ENIG+G/F, Gold plating+G/F，Immersion silver +G/F, Immersion Tin+G/F, ENEPIG | Lead / lead free HAL, Immersion Gold (EING), Immersion Tin, Immersion Silver, OSP, Hard gold plating, ENIG+OSP, ENIG+G/F, Gold plating+G/F，Immersion silver +G/F, Immersion Tin+G/F, ENEPIG | Lead / lead free HAL, Immersion Gold (EING), Immersion Tin, Immersion Silver, OSP, Hard gold plating, ENIG+OSP, ENIG+G/F, Gold plating+G/F，Immersion silver +G/F, Immersion Tin+G/F, ENEPIG | / | |
| 97 | Manufacturing | Inner layer treatment | brown oxygen | brown oxygen | brown oxygen | ||
| 98 | Manufacturing | Minimum routing bit diameter | mm | 0.55 | 0.6 | 0.65 | |
| 99 | Manufacturing | Maximum Aspect Ratio | 12:1( excluding ≤0.2mm bit) | 10:1(excluding≤0.2mm bit) | 8:01 | >10:1, to be evaluated | |
| 100 | Manufacturing | Hole position tolerance (compared to cad data) | mil | ±2 | ±3 | ±3 | ±2mil, to be evaluated |
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