Today's pcb board manufacturers have higher and higher requirements for the welding quality of pcb boards in the production process. As far as the soldering quality of a pcb circuit board is concerned, the most important thing is its reliability should start from the pcb design stage. US Navy statistics found that 40%-60% of the failures of military electronic products are design problems. Now, the editor will explain to you the quality control of PCBA wave soldering in the SMT process in the smt process workshop.

Product development adopts a parallel management mechanism. In production practice, welding defects caused by poor PCBA design in smt chip factories emerge one after another. For these defects, it is difficult to improve the operation and innovate the process alone, which leads to the embarrassing situation of "innate deficiencies, which are difficult to make up for the day after tomorrow". Therefore, the quality control of pcba wave soldering in smt process equipment should start from the design stage of the PCBA, and let the initial assumptions run through the whole process before delivery and packaging.

At the beginning of each new PCBA design, a mechanism for mutual trust and cooperation between design, process, production and quality inspection personnel must be established. That is to say, in the early stage of product development, implementing the technical route of chip processing technology, production and quality inspection personnel in parallel is the only correct way to solve the welding defects caused by poor design. Establish a strict component solderability management mechanism. Solderability of metal surfaces depends on the degree of removal of surface contaminants and oxide films as well as the inherent wettability of the metal. The wave soldering practice of PCBA in smt equipment shows that maintaining good solderability of electronic component leads on pcb circuit boards is the basis for obtaining good solder joints, and it is also an important measure for chip processing factories to obtain the best production efficiency.

In production, it is often found that as long as the solderability of the welding part on the pcb circuit board is good, even if the deviation of the welding process parameters is large, the welding effect can be obtained, that is, the sensitivity to the fluctuation of the SMD process parameters is very low. On the contrary, it is particularly sensitive to fluctuations in SMD processing parameters, the process window is narrow, the operation is difficult, and the welding quality is not easy to stabilize. Therefore, when purchasing components, PCBs, terminals, etc., it is necessary to add regulations such as solderability and maintenance temperature limit time when considering the technical delivery conditions of components to ensure good solderability of components.